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4
PCB Layout Drawing
for Mini Size Module
PIN LEGEND
0.254 0.131 0.027 0.050 TYP 0.027 0.102 0.328 0.467 0.313 38 SEE DETAIL A PCB 0.027 0.027 O 0.032 0.003 16 VIA HOLES 0.065 0.027 0.069 O 0.032 0.003 3 VIA HOLES 0.063 1,59 0.536 13,61 SURFMATE INPUT CONNECTOR 0.250 6,36 0.56 MAX 0.265 0.050 TYP 0.138 0.266 0.340 2.096 53,24 0.230 0.115 7 x O 0.233 FREE OF SOLDER MASK SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS
Mini Pin Number 1 2 3 4 5 6 7 8 9 Symbol + PC PR - - -S SC +S + Function
FARM Symbol Function Neutral EMI Line - Out Enable Strap BUS OK + OUT Pin Dia. (Inches / mm) 0.080 / 2,03 0.080 / 2,03 0.080 / 2,03 0.080 / 2,03 0.150 / 3,81 0.080 / 2,03 0.080 / 2,03 0.080 / 2,03 0.150 / 3,81
O 0.016 NON PLATED THRU 7 PL
+IN N Prim. Control EMI GRD Parallel NC -IN L -OUT - - Sense EN Sec. Control ST +Sense BOK +Out +
w w w . v i c r . c o
0.604 55
2.000 50,8 0.300 7,62
DETAIL A
(MIRROR IMAGE TO OTHER SIDE) ALL DIMENSIONS IN INCHES 1.900 48,26 O 0.032 0.003 29 VIA HOLES 0.027 0.226 0.034 0.065 0.152 0.202 0.350 0.340 0.277 0.050 TYP 0.266 SEE DETAIL B 0.069 7 x O 0.016 0.230 TYP 0.115 O 0.032 0.003 3 VIA HOLES 0.027 0.065 0.063 1,59 0.300 7,62 2 x 0.125 0.002 3,18 0,05
4
3
2
1 6 x o0.064 0.003 1,63 0,08 (#52 DRILL)
MODULE
0.440 11,18 4 3 2 1 0.265 6,73 2.430 61,72 9
1.600 40,64 5 6 7 8 9
PCB MODULE EXCHANGE TOOLBOTH ENDS (PARTIAL) 0.06 1,6 1.98 50,3 678
4 x o 0.130 0.003 3,30 0,08 PLATED THRU HOLE FOR STANDOFF MTG 0.536 13,61 0.097 2,47 0.251 6,36
5
0.80 20,3
0.400 10,16 0.700 17,78 1.000 25,4
0.491 12,47 0.250 6,35 MODULE EXCHANGE TOOL 0.38 9,5 15 1.25 31,6
EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS-SEE VIEWS) MODULE BASEPLATE PCB
m
0.027 0.050 TYP 0.034 0.159 0.318
3 1 2 0.80 0.03 20,3 0,8 0.15 3,8
SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS 2 x O 0.316 FREE OF SOLDER MASK
1.400 35,56 1.900 0.002 48,26 0,05
SURFMATE OUTPUT CONNECTOR
DETAIL B
(MIRROR IMAGE TO OTHER SIDE) ALL DIMENSIONS IN INCHES
PCB MOUNTING SPECIFICATIONS (ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
0.006 REF 0,15
BOTTOM OF CAP TO TOP OF PCB
All dimensions are Inch or Inch / Metric ANSI / IPC-D-300 specifications apply for Class "B" boards. Recommended PCB construction: Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes for connection to power and ground planes shown in Details "A" & "B" for high current applications. Pads to be covered with solder mask except in circular area shown in Detail "A" & "B". Final pad height above laminate to be 0.004" +/- 0.0004". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
DETAIL C
PRODUCT APPLICATION SPECIFICATIONS

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